Electronic Board Level Underfill and Encapsulation Material Market Trends

Growth Drivers

• Growing Investment in the Electronic Industry - The electronics industry is one of the most dynamic sectors of the economy, and its rapid rise has led to significant changes in financing. The consolidation of manufacturing networks in the electronics sector has benefited the ASEAN region, enabling better trade with Asian economic powers such as China. However, China is important to Asia's electronics sector not just as a rival but as a developing market. China buys raw materials and components from other Asian countries and ships them around the world.
• High Demand for Laptops - Electronic circuit board level underfill materials are widely used in laptops. These are used in a wide range of integrated packages and solid-state drive laptops. The demand for laptops is increasing globally due to increasing production and sales and this is expected to drive the market growth during the forecast period. For example, Lenovo is expanding its local manufacturing capacity in India across various product categories, including laptops, according to his 2021 data from India Brand Equity Foundation.

Challenges

• Production of Void in Flip Chip - One of the main concerns has been the creation of voids in the Flip-chip process, which could have a negative impact on market growth over the forecast period. To demonstrate the reliability of the package, an underfill shall be applied in the manufacture of flip chip devices. The formation of a void, which delays the filling procedure, takes place in the underfill process.
• High Cost of Material is Set to Hamper the Market Growth in the Forecast Period
• Lack of Awareness is another Significant Barrier for the Market Growth in Upcoming Period