Flip Chip Market Size & Share, by Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping); Packaging Technology (2D IC, 2.5D IC, 3D IC); Product (Memory, LED, CMOS Image Sensor, GPU, Others); Packaging Type (FC BGA, FC PGA, FC CSP, Others); Application (Consumer Electronics, Telecommunication, Automotive, Others) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2024-2036

Growth Drivers

• Surge in trend for IoT integration - The demand for Internet of Things devices has surged as a result of the introduction of concepts including smart factories, smart manufacturing, and smart grids. There will be a greater need for IoT devices as industrialized nations integrate smart grids with their current networks.
  
  The need for sensors has grown as the market for IoT devices has expanded. IoT sensors must operate at high-performance levels in difficult circumstances due to their small size. Flip chip technology, which can miniaturize equipment and offer higher performance than traditional technologies, is being used in the Internet of Things. Therefore, flip-chip architecture is used in microelectromechanical systems sensors, which propels the expansion of the flip chip market worldwide.
• Growing demand for smartphones - There are expected to be over 5 billion smartphone users globally in 2024, a rise of 2.2% each year. Furthermore, close to 3 billion, or about 83%, more people use smartphones currently than there were in 2013, which was more than ten years ago. Flip-chip technologies have been extensively used for the CPUs of smartphones
• Rising technological advancement in wire bounding - The improvements in flip chip connectivity technology over wire bonding technology are what is driving demand for it. ICs have to be packed into more space using wire bonding technology, and the wires use more energy. In addition, these chips are less reliable given that cables are being used to establish connections, which raises the possibility of malfunction because of lost connections.
  
  Compared to traditional wire-bond packaging, flip chips have several benefits, including increased 1/O capability, improved thermal and electrical performance, substrate flexibility for a range of performance needs, familiarity with well-established production equipment, and smaller form factors.

Challenges

• Lack of mechanical strength - With flip chips, a semiconductor die is connected to a substrate by being nudged and then flipped onto it. Directly on the die input-output pads, bumps are usually arranged in an array over the whole die surface. Since the chip and circuit board are directly connected, there is less resistance and faster signal transmission due to the shorter connection.
  
  Nevertheless, due to their lack of mechanical strength and susceptibility to thermal expansion mismatch, these short-distance bumps may rupture at higher temperatures. Since the amplifier and other components are suspended above a substrate on metal bumps that serve as thermal stand-offs, another problem that arises is the effective removal and dissipation of heat. Using a low-loss substrate in conjunction with a flip-chip device and on-module EMI shielding is a popular design strategy.
• The high price of flip chips is anticipated to hamper the market revenue in the upcoming years.
• Lack of enough customization options is another substantial factor hindering the market growth during the forecast time