Thin Wafer Market Size & Share, by Type (125mm, 200mm, 300mm); Application (MEMS, CMOS Image Sensors, Memory, RF Devices, LEDs, Interposers, Logic) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2023-2035

  • Report ID: 4882
  • Published Date: May 01, 2023
  • Report Format: PDF, PPT

Companies Dominating the Thin Wafer Landscape

top-features-companies
    • Siltronic AG
      • Company Overview
      • Business Strategy
      • Key Product Offerings
      • Financial Performance
      • Key Performance Indicators
      • Risk Analysis
      • Recent Development
      • Regional Presence
      • SWOT Analysis
    • SUMCO Corporation
    • My Chip Production GmbH
    • Global Wafers Co., Ltd.
    • II-VI Incorporated
    • SunEdison Semiconductor Limited
    • 3M Company
    • Applied Material, Inc.
    • Texas Instruments Incorporated

Browse Key Market Insights with Data Illustration:

In-the-news

In The News

  • A contract was inked by the Taiwanese company Global Wafers Co. Ltd. with the Munich-based Siltronic AG to establish a major wafer manufacturer. A “best-in-class” wafer producer was anticipated to be created by combining Siltronic, one of the technology leaders in the wafer industry, and GlobalWafers, with its excellent supply chain management and competitive cost structure, to compete successfully in the future global semiconductor market. It was anticipated that both firms’ product portfolios, which complement one another in several ways and serve as a solid foundation, would profit from the wafer industry's long-term growth drivers.
  • A brand-new eBeam metrology system has been unveiled by Applied Materials, Inc., and it is especially made to measure exactly the crucial dimensions of semiconductor device features that have been patterned using EUV and the burgeoning High-NA EUV lithography.

Author Credits:  Abhishek Verma, Hetal Singh


  • Report ID: 4882
  • Published Date: May 01, 2023
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

The major factors driving the growth of the market are growing adoption of smartphones, rise in data centers, surge in penetration of LEDs, and others.

The market size of thin wafer is anticipated to attain a CAGR of 13% over the forecast period, i.e., 2023-2035.

The major players in the market are Siltronic AG, SUMCO Corporation, My Chip Production GmbH, Global Wafers Co., Ltd. and others.

The 300mm segment is anticipated to garner the largest market size by the end of 2035 and display significant growth opportunities.

The market in the Asia Pacific region is projected to hold the largest market share by the end of 2035 and provide more business opportunities in the future.
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