A contract was inked by the Taiwanese company Global Wafers Co. Ltd. with the Munich-based Siltronic AG to establish a major wafer manufacturer. A “best-in-class” wafer producer was anticipated to be created by combining Siltronic, one of the technology leaders in the wafer industry, and GlobalWafers, with its excellent supply chain management and competitive cost structure, to compete successfully in the future global semiconductor market. It was anticipated that both firms’ product portfolios, which complement one another in several ways and serve as a solid foundation, would profit from the wafer industry's long-term growth drivers.
A brand-new eBeam metrology system has been unveiled by Applied Materials, Inc., and it is especially made to measure exactly the crucial dimensions of semiconductor device features that have been patterned using EUV and the burgeoning High-NA EUV lithography.
Author Credits: Abhishek Verma, Hetal Singh
Report ID: 4882
Published Date: May 01, 2023
Report Format: PDF, PPT
Frequently Asked Questions (FAQ)
The major factors driving the growth of the market are growing adoption of smartphones, rise in data centers, surge in penetration of LEDs, and others.
The market size of thin wafer is anticipated to attain a CAGR of 13% over the forecast period, i.e., 2023-2035.
The major players in the market are Siltronic AG, SUMCO Corporation, My Chip Production GmbH, Global Wafers Co., Ltd. and others.
The 300mm segment is anticipated to garner the largest market size by the end of 2035 and display significant growth opportunities.
The market in the Asia Pacific region is projected to hold the largest market share by the end of 2035 and provide more business opportunities in the future.