Radiation Hardened Electronic Market Trends

Growth Drivers

• Accelerating rate of space exploration: Both national and commercial entities are increasingly involved in the burgeoning space race, which is a key catalyst for the radiation hardened electronic market. Every satellite, probe, and spacecraft that ventures into space requires electronics that can withstand the harsh radiation environment beyond Earth's atmosphere. In a significant story affirming this requirement, BAE Systems announced in March 2023 that its high-performance RAD5545 single board computer had been selected to power the M-STAR mission, testifying to the trust placed in these parts for performing challenging processing operations in extreme space environments.
• Modernization of defense and strategic systems: Continuing modernization of world defense and strategic systems is creating a continuing demand for highly reliable, radiation hardened electronic. They have to be employed in order to maintain the operation of critical assets, ranging from missile defense systems and war-fighting satellites to future fighter aircraft, in the event of a nuclear attack. For instance, in December 2023, the U.S. Department of Commerce funded around USD 35 million in CHIPS Act for BAE Systems to modernize its plant producing rad-hard chips for national defense programs, including the F-35 fighter aircraft.
• New onboard processing and AI technologies: The increasing need for advanced onboard data processing, artificial intelligence (AI), and sensor fusion capability within orbit is pushing the boundaries of rad-hard memory and processor technologies. This demand means denser and faster components that will perform in space. In a milestone moment in history, Mercury Systems announced in January 2024 the first-ever DDR4 memory device qualified for space. This ruggedized 960 GB solid-state drive has been created to endure harsh temperatures and radiation so that advanced data processing is enabled for AI applications on satellite.

Challenges

• Radiation testing sophistication and high expense: One of the significant challenges facing the industry is the high expense, limited availability, and intricacy of radiation testing facilities, required to qualify components for the defense and space industries. This bottleneck can slow down the introduction and application of new technology. In order to alleviate this, the U.S. Defense Advanced Research Projects Agency (DARPA) initiated in June 2023 the Advanced Sources for Single-event Effects Radiation Testing (ASSERT) program. The program aims to create compact, low-cost test sources to make radiation testing more accessible throughout the entire microelectronics design process.
• Strict export controls and regulatory barriers: The military and strategic importance of radiation hardened electronics subjects them to rigorous government controls and export bans, which can be a significant obstacle to manufacturers and overseas allies. The controls are meant to keep harmful technology from falling into adverse hands, but can also complicate the global supply chain. In March 2024, the U.S. Bureau of Industry and Security (BIS) amended the Export Administration Regulations to specify more clearly the controls over these components, setting them at being able to withstand a total ionizing dose of 5 x 10^5 rads (Si) or greater, an important technical parameter governing their trade.