Radiation Hardened Electronic Market Analysis

  • Report ID: 3314
  • Published Date: Aug 09, 2025
  • Report Format: PDF, PPT

Radiation Hardened Electronic Market Segmentation:

Component Segment Analysis

The power management segment is projected to hold a 34.5% share of the market, as the simplest requirement of any electronic system used in a hostile environment is to provide solid, stable, and efficient power. The components involved, such as voltage regulators and power converters, must be extremely rugged to ensure that every other system on a satellite or a strategic missile functions properly and uninterruptedly. In November 2023, Texas Instruments made technical details available to enable engineers to utilize its space-grade power devices, such as the TPS7H4010-SEP, to accelerate the design of durable power supply designs for next-generation FPGAs for space. The relevance of this market is heightened by the rigorous qualification tests that these devices must undergo before they can be considered for defense or space applications.

Manufacturing Technique Segment Analysis

The radiation hardening by design (RHBD) segment is predicted to command a 58% market share by 2035, as this methodology offers a more efficient and effective approach to developing radiation tolerance within semiconductor architecture, as opposed to shielding individual components. Instead of applying shielding to a typical component, RHBD methods change the circuit layout and logic design to make it resistant to the effects of radiation inherently. This methodology is increasingly favored for creating power-efficient, scalable, and reliable solutions.

In April 2025, Microchip Technology announced the completion of its radiation-hardened (rad-hard) power MOSFET family, meeting the MIL-PRF-19500/746 slash-sheet specification. The company also achieved JANSF qualification for its JANSF2N7587U3, a 100V N-channel MOSFET, which can withstand up to 300 Krad (Si) Total Ionizing Dose (TID).  The popularity of the RHBD approach is also evident in recent announcements on new products from leading suppliers, which increasingly rely on this approach to achieve the highest performance levels and radiation tolerance.

Product Type Segment Analysis

The commercial-off-the-shelf (COTS) is expected to dominate the radiation hardened electronic market due to the need to lower costs and accelerate development cycles for space and defense systems, particularly within the expanding NewSpace sector. Manufacturers are able to offer more affordable and available solutions by leveraging proven, high-volume commercial technologies and adapting them for radiation environments.

A critical aspect of this process is gaining official qualification, as evidenced by Microchip Technology's achievement of Qualified Manufacturers List (QML) qualification for its RT PolarFire SoC FPGA in October 2023. This qualification makes the implementation of this COTS-based device more efficient for satellite payloads. The movement towards COTS is also fueling the design of components that are radiation-tolerant rather than fully radiation-hardened, offering a compromise of dependability for less demanding missions, such as those in Low Earth Orbit (LEO).

Our in-depth analysis of the global radiation hardened electronic market includes the following segments:

Segment

Subsegments

Component

  • Mixed Signal ICs
  • Processors & Controllers
  • Memory
  • Power Management
  • Others

Material Type

  • Silicon
  • Silicon Carbide
  • Gallium Nitride
  • Others

Manufacturing Technique

  • Radiation Hardening By Design (RHBD)
  • Radiation Hardening By Process (RHBP)
  • Others

Product Type

  • Commercial off-the-Shelf
  • Custom Made

Application

  • Aerospace & Defense
  • Medical
  • Nuclear Power Plants
  • Space
  • Others

Browse key industry insights with market data tables & charts from the report:

Frequently Asked Questions (FAQ)

In 2025, the industry size of radiation hardened electronic is estimated at USD 1.9 billion.

The global radiation hardened electronic market size was USD 1.9 billion in 2025 and is expected to reach USD 3.1 billion by the end of 2035, expanding at a CAGR of 5.2% during the forecast period, i.e., 2026-2035. In 2026, the industry size of radiation hardened electronic will be valued at USD 2 billion.

Key players in the market are Microchip Technology Inc., BAE Systems PLC, Honeywell International Inc., Infineon Technologies AG, STMicroelectronics, Cobham Limited, Analog Devices, Inc., Texas Instruments Incorporated, Teledyne Technologies Incorporated, Mercury Systems, Inc., Northrop Grumman, 3D PLUS.

The power management segment is anticipated to lead the radiation hardened electronic market during the forecast period.

North America is anticipated to dominate the radiation hardened electronic market during the forecast period.
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