Radiation Hardened Electronic Market Size & Share, by Component Type (Analog, Digital Mixed Signal Devices, Memory Controllers, Processors, Power Management Component); Application (Aerospace & Defense, Nuclear Power Plant, Medical Healthcare) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2024-2036

  • Report ID: 3314
  • Published Date: Oct 03, 2023
  • Report Format: PDF, PPT

Companies Dominating Radiation Hardened Electronic Landscape

top-features-companies
    • Renesas Electronics Corporation
      • Company Overview
      • Business Strategy
      • Key Product Offerings
      • Financial Performance
      • Key Performance Indicators
      • Risk Analysis
      • Recent Development
      • Regional Presence
      • SWOT Analysis
    • Honeywell International Inc.
    • Xilinx, Inc.
    • Atmel Corporation
    • Microchip Technology Inc.
    • Infineon Technologies AG
    • BAE Systems
    • ST Microelectronics
    •  Microsemi Corporation
    • Texas Instruments

Browse Key Market Insights with Data Illustration:

In-the-news

In The News

  • Texas Instruments introduced a new device screening specification called space high-grade in plastic (SHP) for radiation hardened products. These products boost thermal effectiveness, and increase bandwidth in a smaller size.
  • Infineon Technologies AG introduced industry’s first high-density radiation tolerant (RadTol) NOR Flash memory products, to provide an excellent, low pin-count, single-chip solution for tasks including FPGA setup, image storage, microcontroller data storage, and boot code storage. The equipment is radiation tolerant up to 125 krad (Si) unbiased and 30 krad (Si) biased radiation.

Author Credits:  Abhishek Verma, Hetal Singh


  • Report ID: 3314
  • Published Date: Oct 03, 2023
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

Growing demand of semiconductor materials, and rising demand for satellites are the major factors driving the market growth.

The market is anticipated to attain a CAGR of 10% over the forecast period, i.e., 2024-2036.

Exorbitant costs of development and designing, and growing concerns for the effect of radiation on electrical devices are estimated to be the growth hindering factors for the market expansion.

The market in the North America region is projected to hold the largest market share by the end of 2036 and provide more business opportunities in the future.

The major players in the market are Xilinx, Inc., Atmel Corporation, BAE Systems, and STMicroelectronics, among others.
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