Companies Dominating the Next Generation Memory Landscape
- Intel Corporation
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- Honeywell International Inc.
- Micron Technology, Inc.
- Samsung Electronics Co., Ltd
- SK Hynix, Inc.
- Everspin Technologies, Inc.
- Nanya Technology Corporation
- Kingston Technology Corporation
- Infineon Technologies AG
- Crossbar Inc.
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In the News
- SK Hynix Inc. became the industry’s first to develop a 12-layer HBM31 product with a 24 gigabyte 2 memory capacity, currently the largest in the industry. The company succeeded in developing the 24 GB package product that increased the memory capacity by 50% from the previous product, following the mass production of the world’s first HBM3 in June 2022.
- Samsung announced the start of mass production of its 8th generation vertical NAND (V-NAND) chips to enable expanded storage space in next generation server systems. These chips feature the industry's highest bit density and storage capacity. They are expected to enable organizations to expand the storage capacity of next generation enterprise servers while extending their use into the automotive market.