Molded Interconnect Device (MID) Market Share

  • Report ID: 5506
  • Published Date: Sep 16, 2025
  • Report Format: PDF, PPT

Molded Interconnect Device Market Regional Analysis:

North American Market Insights

By 2035, North America region is expected to capture over 36% molded interconnect device market share. The industry growth in the region is also expected on account of technological innovation and industrial advancement. With a strong presence in key sectors like automotive, healthcare, aerospace, and consumer electronics, the region showcases a robust demand for sophisticated, miniaturized, and integrated electronic solutions. The automotive industry, in particular, embraces MID technology for advanced functionalities in sensors, control systems, and compact electronic components, driving innovation within the sector.

Additionally, North America’s emphasis on technological prowess and R&D investments fosters the development of cutting-edge materials and manufacturing techniques crucial for MID production. Collaborations between leading tech firms, research institutions, and manufacturers fuel the region’s market growth, contributing to the creation of versatile and high-performance solutions.

APAC Market Insights

The molded interconnect device market Asia Pacific region will also encounter huge revenue growth during the forecast period and will hold the second position owing to the expanding automotive industry in the region. With a burgeoning demand for compact, multifunctional electronic components across diverse industries, including automotive, consumer electronics, healthcare, and telecommunications, the region witnesses significant MID adoption. Boasting robust manufacturing capabilities, countries like Japan, China, South Korea, and Taiwan spearhead MID development, leveraging advanced materials and cutting-edge manufacturing processes.

The automotive sector’s evolution towards electric and autonomous vehicles, coupled with the surge in demand for IoT devices and wearables, propel the market’s expansion. Further, collaborations between global players and local manufacturers, combined with a focus on sustainability and regulatory compliance, bolster the Asia Pacific- market’s growth trajectory, shaping it into a pivotal region for MID innovation and adoption.

Molded Interconnect Device (MID) Market Size

Browse key industry insights with market data tables & charts from the report:

Frequently Asked Questions (FAQ)

In the year 2026, the industry size of molded interconnect device is estimated at USD 2.44 billion.

The global molded interconnect device market size crossed USD 2.2 billion in 2025 and is likely to expand at a CAGR of over 12.2%, surpassing USD 6.96 billion revenue by 2035.

The North America molded interconnect device (mid) market is expected to capture 36% share by 2035, fueled by technological innovation and industrial advancement.

Key players in the market include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation.
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