Molded Interconnect Device (MID) Market Size & Share, by Product Type (Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems); Application (Telecommunications & Computing, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace); Process (Two-shot molding, Laser Direct Structuring) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2024-2036

  • Report ID: 5506
  • Published Date: Jan 05, 2024
  • Report Format: PDF, PPT

Global Market Size, Forecast, and Trend Highlights Over 2024-2036

Molded Interconnected Device Market size is anticipated to cross USD 4.7 Billion by the end of 2036, growing at a CAGR of 12% during the forecast period, i.e., 2024-2036. In the year 2023, the industry size of molded interconnected devices was over USD 1.2 Billion. As the Internet of Things (IoT) continues to grow, there is an increasing demand for devices that are interconnected and have smaller footprints. This is where Molded Interconnect Device (MIDs) come in. MIDs allow electronic components to be integrated directly into 3D shapes, which enables the creation of smart devices that are more compact and interconnected. With MIDs, designers can create complex geometries, optimize space, and improve functionality. This technology is becoming increasingly popular in a wide range of industries, from healthcare and automotive to consumer electronics and aerospace.

Continuous advancements in manufacturing technologies, such as laser direct structuring (LDS) and 3D printing, have enhanced the production efficiency and flexibility of MIDs. These techniques enable rapid prototyping and customization, catering to diverse industry needs.


Molded Interconnect Devices Market
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Molded Interconnect Device Market: Key Insights

Base Year

2023

Forecast Year

2024-2036

CAGR

~ 12%

Base Year Market Size (2023)

~ USD 1.2 Billion

Forecast Year Market Size (2036)

~ USD 4.7 Billion

Regional Scope

  • North America (U.S., and Canada)
  • Latin America (Mexico, Argentina, Rest of Latin America)
  • Asia-Pacific (Japan, China, India, Indonesia, Malaysia, Australia, Rest of Asia-Pacific)
  • Europe (U.K., Germany, France, Italy, Spain, Russia, NORDIC, Rest of Europe)
  • Middle East and Africa (Israel, GCC North Africa, South Africa, Rest of the Middle East and Africa)
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Molded Interconnect Device Sector: Growth Drivers and Challenges

Market-Growth-Drivers

Growth Drivers

  • Advancements in Automotive Industry- The automotive sector heavily relies on MIDs for various applications such as automotive  sensors, lighting, and control systems. As per estimates, it is anticipated that the global automotive sensor industry will surpass USD 55 billion by 2025. With the rise of electric vehicles (EVs), autonomous driving technology, and the need for more compact and lightweight components, MIDs are becoming increasingly indispensable in this sector.
  • Rising Trend of Miniaturization products - As electronic devices continue to shrink in size while increasing in functionality, there’s a growing demand for compact, MIDs that enable the integration of multiple functionalities into smaller spaces, aligning with the miniaturization trend
  • Evolution of Consumer Electronics -The demand for smaller, sleeker, and more functional consumer electric devices (smartphones, wearables, etc.) drives the need for MIDs. These devices require intricate circuitry and functional design integration, which MIDs facilitate efficiently. In total, the consumer electronics sector brought in around USD 987 billion in revenue in 2022. This propelled opportunities for the mold interconnect device market
  • Innovations in Medical Industry - The healthcare industry leverages MIDs for various applications, including wearable medical devices, monitoring systems, and implantable devices. The need for smaller, more reliable, and customized solutions in the medical field fuels the growth of MIDs. For instance, Pacemaker makers, including Boston Scientific and Medtronic, were among the first in the medical field to adopt C-MOS technology to integrate digital and analog signals into a single-chip device. This enhanced the device's analysis and control capabilities while decreasing its size and weight. Soon, chip design methods akin to those employed in the creation of compact, lightweight, and potent consumer and military goods were applied to the design of digital medical devices, ranging from defibrillators to stethoscopes. Since then, there has been an increased trend toward shrinking processor chips, instruments, connectors, probes, and sensors built into medical equipment, propelling the market’s growth.

Challenges

  • Cost Considerations- Initial setup costs for MID production can be significant due to the specialized equipment and technology required for manufacturing. This might make MIDs less cost-competitive, especially for smaller-scale productions or in industries with stringent cost considerations.
  • Maintaining high-quality standards and reliability across batches poses a challenge in molded interconnect device manufacturing.
  • Lack of standardized protocols might hinder broader adoption, especially in industries with stringent regulatory requirements.


Molded Interconnect Device Segmentation

Product Type (Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems)

The sensor segment is estimated to hold 47% share of the global molded interconnect device market by 2036. Sensors play a crucial role in various industries, including industrial and automotive. The use of temperature sensors, pressure sensors, and other types of sensors is extensive in industrial applications. In totality, the sensor segment garnered USD 22.4 billion in the year 2022. In the automotive sector, sensors are used in adaptive cruise control systems and climate control-related applications. Moreover, the increasing use of Molded Interconnect Device (MIDs) in these applications is driving up the demand for MID sensors during the forecast period. The integration of sensors in these sectors is improving performance, efficiency, and safety. All these factors are cumulatively provided for the market’s growth.

Application (Telecommunications & Computing, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace)

The telecommunication and computing segment in the MID market is estimated to hold the majority revenue share. The strong need for sophisticated electronic circuits that enable the development of 5G devices with low signal loss is attributed to the segment's growth. Electronic businesses, such as Cicor Group, have been working to create MID gear that uses liquid crystal polymers in order to facilitate the high-frequency transmission of 5G signals. 5G had 1.1 billion subscriptions worldwide as of June 2024; 125 million more had been added in just the first quarter. Thirty-five service providers have introduced 5G Standalone (SA) networks, while about 240 service providers have built 5G networks. There are more than 700 5G smartphone models available to consumers as of early 2024, this has a prospective effect on the segment’s growth.

Our in-depth analysis of the global molded interconnect device (MID) market includes the following segments:

          Product Type

  • Antennae & Connectivity Modules.
  • Sensors.
  • Connectors & Switches
  • Lighting Systems.

          Application

  • Telecommunications & Computing.
  • Consumer Electronics
  • Automotive
  • Medical
  • Industrial
  • Military & Aerospace

          Process

  • Two-shot Molding
  • Laser Direct Structuring (LDS)

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Molded Interconnect Device Industry - Regional Synopsis

North American Market Forecast

North American molded interconnect device market is expected to hold a significant revenue share accounting for 45%, owing to technological innovation and industrial advancement. With a strong presence in key sectors like automotive, healthcare, aerospace, and consumer electronics, the region showcases a robust demand for sophisticated, miniaturized, and integrated electronic solutions. The automotive industry, in particular, embraces MID technology for advanced functionalities in sensors, control systems, and compact electronic components, driving innovation within the sector, Additionally, North America’s emphasis on technological prowess and R&D investments fosters the development of cutting-edge materials and manufacturing techniques crucial for MID production. Collaborations between leading tech firms, research institutions, and manufacturers fuel the region’s MID market growth, contributing to the creation of versatile and high-performance solutions. The market’s focus on quality, compliance with stringent regulations, and a penchant for eco-friendly manufacturing processes further solidifies North America’s position as a pivotal hub for MID innovation and market expansion.

APAC Market Statistics

Asia Pacific MID market thrives as a dynamic hub for technological innovation and industrial growth. With a burgeoning demand for compact, multifunctional electronic components across diverse industries, including automotive, consumer electronics, healthcare, and telecommunications, the region witnesses significant MID adoption. Boasting robust manufacturing capabilities, countries like Japan, China, South Korea, and Taiwan spearhead MID development, leveraging advanced materials and cutting-edge manufacturing processes. The automotive sector’s evolution towards electric and autonomous vehicles, coupled with the surge in demand for IoT devices and wearables, propels the MID market’s expansion. Further, Collaborations between global players and local manufacturers, combined with a focus on sustainability and regulatory compliance, bolster the Asia Pacific molded Interconnect Device market’s growth trajectory, shaping it into a pivotal region for MID innovation and adoption.

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Molded Interconnect Devices Market size
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Companies Dominating the Molded Interconnect Device Landscape

top-features-companies
    • Molex
    • TE Connectivity
    • Amphenol Corporation
    • LPKF Laser & Electronics 
    • Taoglas®
    • HARTING Technology Group
    • Arlington Plating Company
    • M.I.D Solutions Pty Ltd
    • 2E mechatronic GmbH & Co. KG
    • DuPont. 

In-the-news

In The News

  • January 2022- In partnership with SOTECH Health, Philips-Medisize, a Molex company, has created a breath sensor system that can identify COVID-19 in under 30 seconds. With its experience in end-to-end production, quick prototyping, and human-centric product design, Philips-Medisize will be of assistance.
  • March 2022- Expanding its SURLOK Plus Series to accommodate energy storage and high-power connection and transfer needs, Amphenol Corporation now offers 8.3 mm and 10.3 mm right-angle connectors with a 1500 voltage range.

Author Credits:  Abhishek Verma, Hetal Singh


  • Report ID: 5506
  • Published Date: Jan 05, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

Continuous advancements in manufacturing technology, innovation in the automotive industry, Evolution of consumer electronics are some of the major market growth drivers.

The market size of molded interconnected devices is anticipated to attain a CAGR of 12% over the forecast period, i.e., 2024-2036.

The major players in the market are Molex, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, Taoglas®, HARTING Technology Group, Arlington Plating Company, M.I.D Solutions Pty Ltd, 2E mechatronic GmbH & Co. KG, DuPont. and others.

The Sensors segment is anticipated to garner the largest market size by the end of 2036 and display significant growth opportunities.

The market in the North American region is projected to hold the largest market share by the end of 2036 and provide more business opportunities in the future.
Molded Interconnect Device (MID) Market Report Scope
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