Molded Interconnect Device (MID) Market Analysis

Product Type (Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems)

In molded interconnect device market, sensors segment is poised to capture over 47% share by 2036. The segment's growth can be attributed to their growing use in various industries, including automotive and industrial. The use of temperature sensors, pressure sensors, and other types of sensors is extensive in industrial applications. In total, the sensor segment garnered USD 22.4 billion in 2022. In the automotive sector, sensors are used in adaptive cruise control systems and climate control-related applications.

Moreover, the increasing use of molded interconnect devices (MIDs) in these applications drives up the demand for MID sensors during the forecast period. The integration of sensors in these sectors is improving performance, efficiency, and safety. All these factors are cumulatively responsible for the market’s growth.

Application (Telecommunications & Computing, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace)

In molded interconnect device market, telecommunications and computing segment is estimated to account for more than 34% revenue share by the end of 2036. The strong need for sophisticated electronic circuits that enable the development of 5G devices with low signal loss is attributed to the segment's growth.

Electronic businesses, such as Cicor Group, have been working to create MID gear that uses liquid crystal polymers in order to facilitate the high-frequency transmission of 5G signals. 5G had 1.1 billion subscriptions worldwide as of June 2024; 125 million more had been added in just the first quarter. Thirty-five service providers have introduced 5G standalone (SA) networks, while about 240 service providers have built 5G networks. There are more than 700 5G smartphone models available to consumers as of early 2024; this has a prospective effect on the segment’s growth.

Our in-depth analysis of the global molded interconnect device (MID) market includes the following segments:

Product Type	Antennae & Connectivity Modules. Sensors. Connectors & Switches Lighting Systems.
Application	Telecommunications & Computing. Consumer Electronics Automotive Medical Industrial Military & Aerospace
Process	Two-shot Molding Laser Direct Structuring (LDS)

Frequently Asked Questions (FAQ)

In the year 2023, the industry size of molded interconnect devices was over USD 4.7 billion.

The market size for molded interconnect devices is projected to cross USD 1.2 billion by the end of 2036 expanding at a CAGR of 12% during the forecast period i.e., between 2024-2036.

The major players in the market are Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation, and others.

In terms of product type, the sensors segment is anticipated to account for the largest market share of 47% during 2024-2036.

The North America molded interconnect devices sector is poised to hold the highest share of 36% by 2036.

Molded Interconnect Device (MID) Market Analysis