Companies Dominating the Molded Interconnect Device Landscape
- Molex LLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- TE Connectivity
- Amphenol Corporation
- LPKF Laser & Electronics
- MacDermid, Inc.
- Cicor Management AG
- S2P Smart Plastic Product
- Teprosa GmbH
- DuPont
- DSM Corporation
Browse Key Market Insights with Data Illustration:
In the News
- Molex, a global electronics pioneer and connectivity inventor, today announced a significant expansion of its global manufacturing footprint with the establishment of a new campus in Katowice, Poland. The facility's initial 23,000 square meters of manufacturing space will serve as a strategic central location to enable Phillips-Medisize, a Molex company, provide sophisticated medical devices on time, as well as electric car and electrification solutions to Molex clients.
- MacDermid Alpha Electronics Solutions will showcase their most recent product and technological developments at the Productronica tradeshow in Munich, Germany. The Electrolube brand's newly announced extremely thermally conductive thermal gap filler and new bio-based conformal coating will be among the show's standout products. The freshly introduced GF600 thermal gap filler has remarkable thermal performance (6.0W/m.K) and is intended to give higher stability than typical thermal interface materials. Electrolube's bio-coating, the first to market, comprises 75% bio-organic substance from renewable sources and is an eco-friendly breakthrough.
