Molded Interconnect Device (MID) Market Size & Share, by Product Type (Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems); Application (Telecommunications & Computing, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace); Process (Two-shot molding, Laser Direct Structuring) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2024-2036

  • Report ID: 5506
  • Published Date: Jan 05, 2024
  • Report Format: PDF, PPT

Companies Dominating the Molded Interconnect Device Landscape

top-features-companies
    • Molex
    • TE Connectivity
    • Amphenol Corporation
    • LPKF Laser & Electronics 
    • Taoglas®
    • HARTING Technology Group
    • Arlington Plating Company
    • M.I.D Solutions Pty Ltd
    • 2E mechatronic GmbH & Co. KG
    • DuPont. 

Browse Key Market Insights with Data Illustration:

In-the-news

In The News

  • January 2022- In partnership with SOTECH Health, Philips-Medisize, a Molex company, has created a breath sensor system that can identify COVID-19 in under 30 seconds. With its experience in end-to-end production, quick prototyping, and human-centric product design, Philips-Medisize will be of assistance.
  • March 2022- Expanding its SURLOK Plus Series to accommodate energy storage and high-power connection and transfer needs, Amphenol Corporation now offers 8.3 mm and 10.3 mm right-angle connectors with a 1500 voltage range.

Author Credits:  Abhishek Verma, Hetal Singh


  • Report ID: 5506
  • Published Date: Jan 05, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

Continuous advancements in manufacturing technology, innovation in the automotive industry, Evolution of consumer electronics are some of the major market growth drivers.

The market size of molded interconnected devices is anticipated to attain a CAGR of 12% over the forecast period, i.e., 2024-2036.

The major players in the market are Molex, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, Taoglas®, HARTING Technology Group, Arlington Plating Company, M.I.D Solutions Pty Ltd, 2E mechatronic GmbH & Co. KG, DuPont. and others.

The Sensors segment is anticipated to garner the largest market size by the end of 2036 and display significant growth opportunities.

The market in the North American region is projected to hold the largest market share by the end of 2036 and provide more business opportunities in the future.
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