Molded Interconnect Device Market Players:
- Molex LLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- TE Connectivity
- Amphenol Corporation
- LPKF Laser & Electronics
- MacDermid, Inc.
- Cicor Management AG
- S2P Smart Plastic Product
- Teprosa GmbH
- DuPont
- DSM Corporation
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2026, the industry size of molded interconnect device is estimated at USD 2.44 billion.
The global molded interconnect device market size crossed USD 2.2 billion in 2025 and is likely to expand at a CAGR of over 12.2%, surpassing USD 6.96 billion revenue by 2035.
The North America molded interconnect device (mid) market is expected to capture 36% share by 2035, fueled by technological innovation and industrial advancement.
Key players in the market include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation.
