Companies Dominating the Molded Interconnect Device Landscape
- Molex LLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- TE Connectivity
- Amphenol Corporation
- LPKF Laser & Electronics
- MacDermid, Inc.
- Cicor Management AG
- S2P Smart Plastic Product
- Teprosa GmbH
- DuPont
- DSM Corporation
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2025, the industry size of molded interconnect device is estimated at USD 1.99 billion.
The molded interconnect device market size was valued at USD 1.82 billion in 2024 and is likely to cross USD 7.49 billion by 2037, expanding at more than 11.5% CAGR during the forecast period i.e., between 2025-2037. The market growth is due to growing connection of IoT to these devices.
North America industry is anticipated to hold largest revenue share of 36% by 2037, due to growing technological innovation and industrial advancement in the region.
The major players in the market include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation
