Companies Dominating the High-Speed Interconnects Market
- Molex, LLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- Nexans
- Leoni Group
- Samtec Solutions Private Limited
- CBO GmbH
- Cisco Systems, Inc.
- Huawei Technologies Co, Ltd.
- Intel Corporation
- The Siemon Company
- Broadcom, Inc.
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2025, the industry size of high-speed interconnects is evaluated at USD 5.68 billion.
The high-speed interconnects market size was over USD 4.86 billion in 2024 and is poised to exceed USD 16.98 billion by 2037, growing at over 10.1% CAGR during the forecast period i.e., between 2025-2037. The market growth is driven by growing number of people working from home, growing IoT connected devices, and a surge in video streaming or other social activities.
Asia Pacific industry is predicted to dominate majority revenue share of 30% by 2037, backed by growing adoption of automotive in the region.
The major players in the market are Molex, LLC, Nexans, Leoni Group, Samtec Solutions Private Limited, CBO GmbH, Cisco Systems, Inc., Huawei Technologies Co, Ltd., Intel Corporation, The Siemon Company, Broadcom, Inc.
