High-Speed Interconnects Market Players:
- Molex, LLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- Nexans
- Leoni Group
- Samtec Solutions Private Limited
- CBO GmbH
- Cisco Systems, Inc.
- Huawei Technologies Co, Ltd.
- Intel Corporation
- The Siemon Company
- Broadcom, Inc.
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2026, the industry size of high-speed interconnects is assessed at USD 45.23 billion.
The global high-speed interconnects market size surpassed USD 41.6 billion in 2025 and is projected to witness a CAGR of more than 9.7%, crossing USD 104.99 billion revenue by 2035.
The Asia Pacific high-speed interconnects market is projected to capture a 30% share by 2035, driven by rising automotive sales, advanced driver assistance systems, vehicle communication needs, and presence of electronic manufacturing.
Key players in the market include Molex, LLC, Nexans, Leoni Group, Samtec Solutions Private Limited, CBO GmbH, Cisco Systems, Inc., Huawei Technologies Co, Ltd., Intel Corporation, The Siemon Company, Broadcom, Inc.
