Wi-Fi Chipset Market Segmentation:
Chipset Type
The Wi-Fi 6 segment in Wi-Fi chipset market is all set to account for the revenue share of 74% during the analysis timeframe, attributed to the consistently growing industries such as e-commerce and retail. The expansion of these industries necessitates wireless connectivity to manage and point-of-sale systems, inventory tracking, and customer engagement. Various retail stores are partnering with network providers and are increasingly adopting the AI-driven Wi-Fi 6 technology due to its reduced latency and enhanced capacity. In April 2023, Halfords, a UK-based provider of motoring and cycling products, partnered with Juniper Networks to deploy AI-based Wi-Fi 6 solutions across its stores, garages, and offices. This deployment aims to enhance operational efficiency and customer experiences by providing high-speed and reliable wireless connectivity.
MIMO Configuration
The MU-MIMO configuration segment is expected to register the fastest growth during the forecast period. The incorporation of MU-MIMO technology into modern Wi-Fi standards, particularly in the Wi-Fi 6 and the emerging Wi-Fi 7, improves wireless network efficiency and capacity. Companies are implementing technology advancements in MU-MIMO configuration, so that the Wi-Fi standards can transmit data simultaneously to multiple devices, optimizing bandwidth utilization and reducing latency.
A surge in the requirement for high-density public Wi-Fi networks at stadiums, airports, and in busy urban areas is boosting the adoption of MU-MIMO technology. Companies are developing MU-MIMO technology to enhance user experience and manage multiple simultaneous connections effectively in dense environments. For instance, in April 2023, TP-Link launched the Archer BE900 wireless router, featuring advanced MU-MIMO capabilities tailored for high-traffic public spaces, reflecting the industry's commitment to addressing connectivity challenges in densely populated settings.
Our in-depth analysis of the global market includes the following segments:
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Chipset Type |
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Protocol |
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MIMO Configuration |
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Application |
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