MacDermid Alpha stated in December 2021 that it will showcase its underfill solutions from the ALPHA HiTech portfolio at the IPC APEX EXPO in California. MacDermid Alpha will be able to increase the market share of its underfill products portfolio thanks to these advancements.
Dymax Corporation unveiled Multi Cure -9037-F, an encapsulation for printed circuit board assembly, in June 2020.
Author Credits: Smruti Ranjan, Rajrani Baghel
Report ID: 5595
Published Date: Feb 02, 2024
Report Format: PDF, PPT
Frequently Asked Questions (FAQ)
The growing demand for laptop and increasing penetration of smartphones are some of the major factors anticipated to drive the growth of the electronic board level underfill and encapsulation material market.
The market is anticipated to attain a CAGR of ~6% over the forecast period, i.e., 2024-2036.
The major players in the market are of Showa Denko Materials Co., Ltd., Zymet, MacDermid Alpha, Epoxy Technology Inc, Lord Corporation, Dymax Corporation, and others.
The flip chip segment is anticipated to garner the largest market size by the end of 2036 and display significant growth opportunities.
The market in Asia Pacific is projected to hold the largest market share by the end of 2036 and provide more business opportunities in the future.