Electronic Board Level Underfill and Encapsulation Material Market Players:
- Protavic America
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- Henkel
- Namics AI Technology, Inc
- H.B. Fuller
- Showa Denko Materials Co., Ltd.
- Zymet
- MacDermid Alpha
- Epoxy Technology Inc
- Lord Corporation
- Dymax Corporation
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2026, the industry size of electronic board level underfill and encapsulation material is evaluated at USD 375.41 million.
The global electronic board level underfill and encapsulation material market size was worth more than USD 358.63 million in 2025 and is poised to witness a CAGR of over 5.2%, crossing USD 595.39 million revenue by 2035.
By 2035, the Asia Pacific region is projected to secure a 33% share in the electronic board level underfill and encapsulation material market, encouraged by the rapid expansion of the consumer electronics sector.
Key players in the market include Showa Denko Materials Co., Ltd., Zymet, MacDermid Alpha, Epoxy Technology Inc, Lord Corporation, Dymax Corporation.
