Electronic Board Level Underfill and Encapsulation Material Market Size & Share, by Product Type (Underfills, Gob Top Encapsulations); Material Type (Quartz/Silicone, Alumina Based, Epoxy Based, Urethane Based, Acrylic Based); Board Type (CSP, BGA, Flip Chips) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2024-2036

  • Report ID: 5595
  • Published Date: Feb 02, 2024
  • Report Format: PDF, PPT

Companies Dominating the Electronic Board Level Underfill and Encapsulation Material Landscape

top-features-companies
    • Protavic America
      • Company Overview
      • Business Strategy
      • Key Product Offerings
      • Financial Performance
      • Key Performance Indicators
      • Risk Analysis
      • Recent Development
      • Regional Presence
      • SWOT Analysis
    • Henkel
    • Namics AI Technology, Inc
    • H.B. Fuller
    • Showa Denko Materials Co., Ltd.
    • Zymet
    • MacDermid Alpha
    • Epoxy Technology Inc
    • Lord Corporation
    • Dymax Corporation


In-the-news

In The News

  • MacDermid Alpha stated in December 2021 that it will showcase its underfill solutions from the ALPHA HiTech portfolio at the IPC APEX EXPO in California. MacDermid Alpha will be able to increase the market share of its underfill products portfolio thanks to these advancements.
  • Dymax Corporation unveiled Multi Cure -9037-F, an encapsulation for printed circuit board assembly, in June 2020.

Author Credits:  Smruti Ranjan, Rajrani Baghel


  • Report ID: 5595
  • Published Date: Feb 02, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

The growing demand for laptop and increasing penetration of smartphones are some of the major factors anticipated to drive the growth of the electronic board level underfill and encapsulation material market.

The market is anticipated to attain a CAGR of ~6% over the forecast period, i.e., 2024-2036.

The major players in the market are of Showa Denko Materials Co., Ltd., Zymet, MacDermid Alpha, Epoxy Technology Inc, Lord Corporation, Dymax Corporation, and others.

The flip chip segment is anticipated to garner the largest market size by the end of 2036 and display significant growth opportunities.

The market in Asia Pacific is projected to hold the largest market share by the end of 2036 and provide more business opportunities in the future.
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