Cloud Electronic Design Automation Market Analysis

Type (Computer Aided Engineering, Semiconductor Intellectual Property, IC Physical Design & Verification, Printed Circuit Board & Multi-Chip Module)

The computer aided engineering segment is anticipated to hold 35% share of the global cloud electronic design automation market by 2037. The growing need for integrated software solutions to get rid of multiple prototype products and product recall concerns, the sharp shift from on-premise computing to cloud-based computing, and the increased outsourcing of manufacturing processes to emerging economies are all contributing factors to the segment's growth. Purchases of gear, software licensing, installation, and support costs are reduced by cloud computing. In the upcoming years, it is anticipated that this will improve the utilization of CAE software even further. Moreover, companies are setting up a private cloud with improved computing and storage capacities utilizing the Hyper-Converged Infrastructure (HCI) platform. Throughout the projection period, these elements would support the segment's expansion even more. By 2025, 200 ZB of data will be kept in the cloud. The cloud stores 60% of all corporate data worldwide.

Vertical (Automotive, Consumer Electronics, Aerospace & Defense, Industrial, Healthcare, Telecommunication)

The consumer electronics segment in the cloud electronic design automation (EDA) market is attributed to hold the largest revenue share of about 30% during the forecast period. Electronics makers would be encouraged to use EDA due to the increasing need for smart gadgets. To improve the quality of their smart products, consumer electronics OEMs are teaming up with top System-on-Chip (SoC) and IC producers, such as Qualcomm Technologies, Inc., Texas Instruments Incorporated, NXP Semiconductors, and Intel Corporation. For example, to speed up 3D-IC design, Cadence Design Systems and Samsung Foundry, a South Korean supplier of foundry technologies, increased their collaboration in October 2022. The extended relationship with Samsung Foundry's 3D-IC technique will make the Cadence Integrity 3D-IC platform available. Customers may maximize the performance, power, and area of each die by using the Cadence platform.

Our in-depth analysis of the global cloud electronic design automation market includes the following segments: