Global Ball Grid Array (BGA) Packaging Market Overview
Ball grid array (BGA) packaging is used for integrated circuits for permanent surface mounting. A ball grid array is more preferable for large number of microchips packaging as they offer higher number of interconnection pins than a flat or dual in-line package. In BGA packaging, instead of just the perimeter, the surface at the bottom of the device can be used. BGA is a descendent of pin grid array which has pins arranged in a grid pattern with one face covered that conducts in operation electrical signal between printed circuit board and the integrated circuit. The pins are replaced by pads in a ball grid array package bottom, a tiny solder ball initially attached to each. The solder balls are held in place with a tacky flux that can be placed by automated equipment or even manually. The attached balls are then melted by heating either in an infrared heater or in a reflow oven. The molten solder on solidifying forms soldered connections between the PCB and the device. In multi-chip stacked modules, two packages can be connected using the solder balls.
Market Size & Forecast
Ball Grid Array Packaging Market is anticipated to record a CAGR of 4.1% over the forecast period. The Ball Grid Array Packaging Market is expected to reach a value of USD 459 million at the end of the forecast period. Many multi-national companies are concentrating towards new product advances in Ball Grid Array Packaging. Moreover, the many advantageous properties of Ball Grid Array packaging are exploited in the field of electronic devices now and then. New uses for Ball Grid Array Packaging are discovered on regular basis in new electronic devices which is expected to drive the Ball Grid Array packaging market rapidly.
Currently, the global Ball Grid Array Packaging market is observing vibrant growth on the back of increasing demand of electronic devices in the market. Advances in electronic gadgets industry in the past few years and growing technological explorations are projected to drive Ball Grid Array Packaging market besides the wide range of functions of Ball Grid Array Packaging in an immense range of applications such as integrated circuits, electronic circuits in various electronic devices during the forecast period. On the basis of regional platform, global Ball Grid Array Packaging market is segmented into five major regions including North America, Europe, Asia Pacific, Latin America and Middle East & Africa region.
As a permanent multiple microchips connector in various electronic devices, North America is panned to observe substantial growth of the Ball Grid Array Packaging market due to rising demand for electronic devices or gadgets across the region. North America is anticipated to be followed by Asia Pacific in terms of consumption due to expanding Ball Grid Array Packaging requirements in expanding digitization industry across the region. On account of multiplying uses of Ball Grid Array Packaging uses in growing electronic industry, Asia Pacific is budding as a regional Ball Grid Array Packaging consumption market.Europe is expected to drive demand and positively impact Ball Grid Array Packaging market growth over the forecast period owing to increasing Ball Grid Array Packaging application for low inductance lead devices. However, weak economic conditions in countries such as Russia, Spain and others is expected to showcase a more modest growth of the Ball Grid Array Packaging manifold market across the region over the forecast period.CLICK TO DOWNLOAD FREE SAMPLE
Our-in depth analysis of the global Ball Grid Array (BGA) Packaging market includes the following segments:
By Process Manufacture
By Sales Channel
Global Ball Grid Array (BGA) Packaging Market is further classified on the basis of region as follows:
Growth Drivers & Challenges
The rising demand for Ball Grid Array Packaging and its by-products in growing electronic industry are expected to drive the market rapidly over the forecast period. The growing R&D activity associated with the discovery of new electronic devices is further expected to increase the market growth owing to the discovery of new applications of BGA in new devices. Properties such as, heat conductivity, high density and low-inductance leads is expected to contribute significantly in BGA packaging market. Rapid economic development along with a thriving manufacturing sector is expected to boost the Ball Grid Array Packaging market in the around the world. Moreover, denser packaging, higher performance and low cost of BGA packages are anticipated to drive the market during the forecast period.
However, non-compliant connectivity and difficulty of inspection due to critically complex design of ball grid array packaging is expected to serve as a key restraint in the growth of the BGA packaging market.
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