Through-hole Passive Components Market - Growth Drivers and Challenges
Growth Drivers
- Automotive electronics expansion - The automotive industry’s evolution towards smart and electric vehicles has significantly propelled the demand for through-hole passive components. These components are crucial for various automotive applications, including infotainment systems, safety features, engine control units, and more.
- Industrial automation - With the rise of Industry 4.0, the demand for through-hole passive components has surged. These components are integral to the functioning of automated systems, robotics, sensors, and control systems in manufacturing and industrial settings.
- Global connectivity demands - The push for enhanced connectivity worldwide including increased internet penetration, Wi-Fi expansion, the rollout of 5G networks, and next generation wireless network has augmented the demand for through-hole passive components needed in network infrastructure, routers, modems, and communication systems.
Challenges
- Miniaturization demands - One of the forecast challenges is the incessant demand for smaller, lighter, and more compact electronic devices. Through-hole components traditionally have larger footprints than their surface-mount counterparts, making it challenging to meet the miniaturization requirements without compromising their performance and reliability.
- The market faces intense price competition.
- Increasing environmental regulations and consumer demands for eco-friendly products present challenges in terms of material sourcing.
Through-hole Passive Components Market Size and Forecast:
|
Base Year |
2025 |
|
Forecast Year |
2026-2035 |
|
CAGR |
7.5% |
|
Base Year Market Size (2025) |
USD 42.21 billion |
|
Forecast Year Market Size (2035) |
USD 87 billion |
|
Regional Scope |
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Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2026, the industry size of through-hole passive components is assessed at USD 45.06 billion.
The global through-hole passive components market size was valued at more than USD 42.21 billion in 2025 and is expected to register a CAGR of over 7.5%, exceeding USD 87 billion revenue by 2035.
The Asia Pacific region is anticipated to hold a 44% share by 2035 in the through-hole passive components market, attributed to growing implementation of modules across automotive, consumer electronics, and industrial applications.
Key players in the market include TT Electronics PLC, Bourns, Inc., TDK Electronics AG, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD., Walsin Technology Corporation, Yageo Corporation, KEMET Corporation, Vishay Intertechnology, Inc., Nippon Chemi-Con Corporation.
