Companies Dominating the Through-hole Passive Components Landscape
- TT Electronics PLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- Bourns, Inc.
- CORNELL DUBILIER AND CORNELL DUBILIER MARKETING, INC.
- TDK Electronics AG
- SAMSUNG ELECTRO-MECHANICS
- TAIYO YUDEN CO., LTD.
- Walsin Technology Corporation
- Yageo Corporation
- KEMET Corporation.
- KYOCERA AVX Components Corporation
- TDK Corporation.
- Vishay Intertechnology, Inc.
- Nippon Chemi-Con Corporation.
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2025, the industry size of through-hole passive components is estimated at USD 42.21 billion.
The through-hole passive components market size was valued at USD 39.68 billion in 2024 and is likely to cross USD 101.6 billion by 2037, expanding at more than 7.5% CAGR during the forecast period i.e., between 2025-2037. The increase in data volume from various industries such as automotive, consumer electronics, telecommunications, and healthcare will fuel the market growth.
Asia Pacific industry is anticipated to hold largest revenue share of 44% by 2037, due to high demand for consumer electronics and automotive sector in the region.
The axial leads segment is anticipated to garner the largest market size of 62% by the end of 2036 and display significant growth opportunities.
