Physical Vapor Deposition Market Analysis

  • Report ID: 6297
  • Published Date: Sep 17, 2025
  • Report Format: PDF, PPT

Physical Vapor Deposition Market Segmentation:

Process Segment Analysis

Sputtering segment is anticipated to account for physical vapor deposition market share of around 48.1% by 2035 on account of its widespread use and significant advantages in various applications. For instance, sputtering is extensively used for depositing thin films in semiconductor devices, including metallization, dielectric layers, and interconnects. As semiconductor devices become more advanced, sputtering technology continues to evolve to meet these needs. Further, for applications such as touchscreens and LED displays, sputtering is used to deposit transparent conductive oxides like indium oxide (ITO). These materials provide conductivity while remaining transparent to visible light.

Additionally, optical filter manufacturers frequently use sputtering technology to produce high-precision filters. Sputtering is particularly well-suited for this application due to its ability to deposit thin, uniform layers with precise control over thickness and composition. For instance, Semrock, a business unit of IDEX Health & Science, manufactures all of its optical filters using sophisticated Ion Beam Sputtering (IBS) technology, resulting in patented state-of-the-art filters with exceptionally durable hard glass coatings on a single hard glass substrate.

End-user Segment Analysis

The electronics semiconductors segment is expected to register significant physical vapor deposition market revenue in the coming years. This growth is attributed to an increase in demand for microelectronics led by technological advancements, a growing need for smart gadgets, and the adoption of cutting-edge innovations including 5G and artificial intelligence (AI). For instance, the global microelectronics industry reached over USD 325 billion in 2022.

Additionally, AI and machine learning algorithms are increasingly used to optimize the design of semiconductor devices and improve manufacturing processes. In the context of PVD, AI can help refine deposition techniques, improve film uniformity, and predict the outcomes of different deposition parameters, leading to higher quality and performance of semiconductor components.

Our in-depth analysis of the physical vapor deposition market includes the following segments:

            Type

  • Materials
  • Equipment
  • Services

            Process

  • Thermal Evaporation
  • Sputtering
  • IonPlating

            End-user

  • Electronics Semiconductors
  • Automotive
  • Aerospace & Defense
  • Healthcare
  • Energy
  • Packaging
  • Industrial

            Substrate

  • Metals
  • Plastics
  • Glass 

Browse key industry insights with market data tables & charts from the report:

Frequently Asked Questions (FAQ)

In the year 2026, the industry size of physical vapor deposition is estimated at USD 20.6 billion.

The global physical vapor deposition market size crossed USD 19.18 billion in 2025 and is likely to register a CAGR of more than 8.2%, exceeding USD 42.18 billion revenue by 2035.

The Asia Pacific physical vapor deposition market achieves a 44% share by 2035, driven by increased spending on renewable energy, particularly solar energy, encouraging the use of PVD in manufacturing.

Key players in the market include OC Oerlikon Management AG, Kurt J. Lesker Company, Voestalpine AG, IHI Corporation, HEF Groupe, Kobe Steel Ltd., Lafer S.p.A., Inorcoat.
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