PCB Design and Stack-Up Market Size & Share, by Application (Flex Circuits, Rigid-Flex Circuits, Rigid Circuits, Hybrid Circuits, High-Density Interconnected); End-user (Consumer Electronics, Communications, Computers, Automotive); Designers (Cadence Design Systems, Inc., Altium Limited, Autodesk, Inc., Siemens AG, ANSYS, Inc.) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2019-2021

Global PCB Design and Stack-Up Market Definition 

Stack-up is a critical step in the PCB manufacturing and design process. Reduced electromagnetic emission (EM) from electronic circuits is mostly achieved by good stack-up design. Consequently, the circuit board's overall signal integrity is improved. However, a subpar stack-up design may result in increased EM emission and signal losses. Hence, every PCB designer aims at lowering EM emission from PCB loops brought on by differential-mode noise and common-mode emission. And this is achieved by good PCB stack-up design.

However, before board layout design, a PCB's copper layers and insulating layers are arranged in a stack-up. This layer stack-up enables developers to fit more circuitry on a single board owing to the multiple PCB board layers. Multiple layers improve the board's capacity to distribute energy, lessen cross-interference, remove electromagnetic interference, and enable high-speed signals.

Further, the structure of the PCB stack-up design offers several other benefits in addition to allowing designer to fit multiple electronic circuits on a single board. These benefits include, decrease radiation, and impedance, as well as the sensitivity of the circuit to outside noise. Also, a good PCB stack could also aid in efficient and affordable final production.

Global PCB Design and Stack-Up Market: Key Insights 

Global PCB Design and Stack-Up Market Size, Forecast, and Trend Highlights Over 2019 - 2021

The global PCB design and stack-up market is estimated to garner a volume of 120 thousand designs by the end of 2021 by growing at a CAGR of 9.6% over the forecast period, i.e., 2019-2021. Further, the market generated a volume of 100 thousand designs in the year 2019. The growth of the market can be attributed to increased utilization in the majority of applications requiring smaller, denser interconnects such as for mobile devices. Technology has significantly improved communication devices throughout the world over the time. Researchers and engineers are continuously coming up with innovative methods to make smart phones smaller, faster, and more effective. Hence, printed circuit boards (PCBs) have become smaller and more powerful as a result of the expansion of their capabilities. This enables producers to pack more components into a smaller space to give all of the features consumers have come to anticipate, such as touch screens, Wi-Fi connectivity, and cameras. Hence growing demand for smart phones is estimated to boost the growth of the market. For instance, global mobile phone sales in 2021 totaled approximately 1740 million units, which translates to about 7800 million people, or about 20% of the world's population, buying a mobile phone that year.

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Further, there has been robust growth in smartwatch users all around the globe which is also expected to boost the market growth. Around 200 million people used smartwatches in 2021, which was the estimated number of users worldwide. Estimates indicate that there would be a rise in users over the next few years, with roughly around 230 users in 2026. Additionally, the market for PCB design and stack-up is booming owing to the increase uses of electronic downsizing in a variety of industries, including the military, defense, aerospace, industrial, and renewable sectors. For instance, in order to save fuel costs and drastically lower pollutants, the aerospace industries have been yearning for smaller and lighter components. Additionally, the healthcare sector needs compact, light-weight handheld instruments, wearable sensors, and implantable devices such as medical equipment such as hearing aids and active implants that integrate PCBs with flexible substrates to maximize integration density and fit into the smallest possible space. Furthermore, electronic components are being incorporated by automakers into their automobiles in greater quantities. Previously, PCBs were primarily used for things which includes headlight switches and windscreen wipers, but recently they enable many high-tech features that improve safety and ease while driving.

Global PCB Design and Stack-Up Market: Growth Drivers and Challenges

Growth Drivers

• Rise in Number of IoT Devices

From about 8 billion IoT devices in 2020 to more than 25 billion IoT devices in 2030, the number of IoT devices is expected to nearly treble. China would have almost 4 billion consumer IoT devices by 2030, making it the country with the most of them.

Since the amount of data used by organizations has been significantly expanding, high performance computing (HPC) is employed in the development of technologies such as IoT, AI, and 3D imaging. This boosts the ability to process the data in real time. Hence driving the growth of the market.

• Robust Investment in Semiconductor Industry

For instance, the United States Innovation and Competition Act (USICA), which includes USD 52 billion to support domestic chip manufacture, research, and design, was enacted by the U.S. Senate in June 2021.

• Government Initiatives for Engendering Digitalization

Initiatives have been launched by the Union government as part of the Digital India program. The plans and programs are broken down into three groups: digital infrastructure, government and on-demand services, and citizen digital empowerment.

• Surge in Disposable Income

The United States' disposable personal income in September 2022 grew from the same month the previous year by about 0.3 percent. Hence owing to this growth in disposable income more people are expected to purchase smartphones and other electronic products. Therefore, further boosting the market growth.

• Growing Use of Internet

There were estimated to be about 3 billion active internet users worldwide in 2022. That represents approximately 60% of the entire world's population.

Challenges

• Cyber Security Threat - PCBs are increasingly susceptible to malicious alterations made during design or production in facilities used by outside manufacturers. A printed circuit board could be modified in one of three ways: by adding more components to the schematic, by adding extra components to the layout, or by changing the drill and Gerber files. End-use businesses frequently import, integrate, and outsource untrusted components onto PCBs in order to lower manufacturing costs, which leaves them extremely vulnerable to Trojan attacks. Hence this factor is expected to hamper the growth of the market.

• High Manufacturing Costs
• Strict Government Regulations

Global PCB Design and Stack-Up Market Segmentation

The global PCB design and stack-up market is segmented and analyzed for demand and supply by end-user into consumer electronics, communications, computers, automotive, and others. Out of these segments, the computers segment is anticipated to generate the largest volume of 35.4 thousand designs by the end of 2021, up from a volume of 29.5 thousand designs in the year 2019. The segment is expanding more quickly as a result of the rising use and demand for computers, laptops, and tablets around the world. Owing to the production of portable computers and laptops, the segment is likewise growing more quickly. Another driver of the segment's growth is the increasing global adoption of technology. The expansion of Internet access and technology is another factor driving the market. For instance, there are up to approximately 25,000 new internet users every single hour, according to an estimate.

The global PCB design and stack-up market is also segmented and analyzed for demand and supply by application into flex circuits, rigid-flex circuits, rigid circuits, hybrid circuits, high-density interconnect, and others. Amongst these segments, the rigid circuits segment is anticipated to hold the largest market volume of 65.0 thousand designs by the end of 2021, up from a volume of 54.2 thousand designs in the year 2019. The growth of this segment can be attributed to the growing acceptance of stiff circuits in recent years and their affordability for PCB design. Further, since rigid circuits are durable and could be made in huge quantities, the market is expanding more quickly. Additionally, given the increasing use of rigid circuits in computers, laptops, tablets, smartphones, and other medical equipment such as X-ray machines, heart monitors, and MRI systems, among other things, the segment growth is quicker than average.

Our in-depth analysis of the global PCB design and stack-up market includes the following segments:

Global PCB Design and Stack-Up Market Regional Synopsis 

The North America PCB design and stack-up market, amongst the market in all the other regions, is projected to hold the largest market volume of 48.7 thousand designs by the end of 2021, up from a value of 40.6 thousand designs in the year 2019. Growing semiconductor industry, increasing preference for high-speed analogue circuits across multiple industries, and rise in imports of PCB designs is expected to boost the growth of the market in this region. The PCB manufacturing companies struggle to be cost-effective since they lack the capability for large-scale production and the funds to buy more equipment. As a result, they concentrate more on importing PCBs. For instance, the United States imported USD 1.98 billion worth of printed circuit boards in 2020, moving up to the seventh-largest importer in the world.

Top Featured Companies Dominating the Global PCB Design and Stack-Up Market 

• Zuken UK Limited

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• SWOT Analysis 

• Cadence Design Systems, Inc.
• Autodesk Inc.
• Altium Limited
• EasyEDA LCC
• Siemens AG
• Downstream Technologies, LLC
• Novarm Limited
• ANSYS, Inc.