PCB Design and Stack-Up Market Analysis by Application (Flex Circuits, Rigid-Flex Circuits, Rigid Circuits, Hybrid Circuits, High-Density Interconnected, and Others); by End-User (Consumer Electronics, Communications, Computers, Automotive, and Others); and by Designers (Cadence Design Systems, Inc., Altium Limited, Autodesk, Inc., Siemens AG, ANSYS, Inc., and Others) – Global Demand Analysis & Opportunity Outlook 2019-2021
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In 2022 & 2023, market players expected to sail in rough waters; might incur losses due to huge gap in currency translation followed by contracting revenues, shrinking profit margins & cost pressure on logistics and supply chain. Further, U.S. economy is expected to grow merely by 3% in 2022. Purchasing power in the country is expected to fell nearly by 2.5%.
On the other hand, European countries to see the worst coming in the form of energy crisis especially in upcoming winters!! Right after COVID-19, inflation has started gripping the economies across the globe. Higher than anticipated inflation, especially in western world had raised concerns for national banks and financial institutions to control the economic loss and safeguard the interest of the businesses. Increased interest rates, strong USD inflated oil prices, looming prices for gas and energy resources due to Ukraine-Russia conflict, China economic slowdown (~4% in 2022) disrupting the production and global supply chain and other factors would impact each industry negatively.
Cadence Design Systems, Inc. announced the launch of a broad ecosystem with nine initial printed circuit board (PCB) manufacturing partners to enable customers to readily obtain the technology files required by the partners to ensure PCB design manufacturability early in the design process.
Altium Limited has released Altium Designer 22, which contains improved capabilities that lessen manual design duties, new features to assist designers in sourcing component availability, and cutting-edge real-time lifecycle management tools used in conjunction with Altium 365.
Stack-up is a critical step in the PCB manufacturing and design process. Reduced electromagnetic emission (EM) from electronic circuits is mostly achieved by good stack-up design. Consequently, the circuit board's overall signal integrity is improved. However, a subpar stack-up design may result in increased EM emission and signal losses. Hence, every PCB designer aims at lowering EM emission from PCB loops brought on by differential-mode noise and common-mode emission. And this is achieved by good PCB stack-up design.
However, before board layout design, a PCB's copper layers and insulating layers are arranged in a stack-up. This layer stack-up enables developers to fit more circuitry on a single board owing to the multiple PCB board layers. Multiple layers improve the board's capacity to distribute energy, lessen cross-interference, remove electromagnetic interference, and enable high-speed signals.
Further, the structure of the PCB stack-up design offers several other benefits in addition to allowing designer to fit multiple electronic circuits on a single board. These benefits include, decrease radiation, and impedance, as well as the sensitivity of the circuit to outside noise. Also, a good PCB stack could also aid in efficient and affordable final production.
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Base Year |
2019 |
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Forecast Year |
2019-2021 |
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CAGR |
9.6% |
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Base Year Market Volume (2019) |
100 Thousand Designs |
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Forecast Year Market Volume (2021) |
120 Thousand Designs |
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Regional Scope |
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The global PCB design and stack-up market is estimated to garner a volume of 120 thousand designs by the end of 2021 by growing at a CAGR of 9.6% over the forecast period, i.e., 2019-2021. Further, the market generated a volume of 100 thousand designs in the year 2019. The growth of the market can be attributed to increased utilization in the majority of applications requiring smaller, denser interconnects such as for mobile devices. Technology has significantly improved communication devices throughout the world over the time. Researchers and engineers are continuously coming up with innovative methods to make smart phones smaller, faster, and more effective. Hence, printed circuit boards (PCBs) have become smaller and more powerful as a result of the expansion of their capabilities. This enables producers to pack more components into a smaller space to give all of the features consumers have come to anticipate, such as touch screens, Wi-Fi connectivity, and cameras. Hence growing demand for smart phones is estimated to boost the growth of the market. For instance, global mobile phone sales in 2021 totaled approximately 1740 million units, which translates to about 7800 million people, or about 20% of the world's population, buying a mobile phone that year.
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Further, there has been robust growth in smartwatch users all around the globe which is also expected to boost the market growth. Around 200 million people used smartwatches in 2021, which was the estimated number of users worldwide. Estimates indicate that there would be a rise in users over the next few years, with roughly around 230 users in 2026. Additionally, the market for PCB design and stack-up is booming owing to the increase uses of electronic downsizing in a variety of industries, including the military, defense, aerospace, industrial, and renewable sectors. For instance, in order to save fuel costs and drastically lower pollutants, the aerospace industries have been yearning for smaller and lighter components. Additionally, the healthcare sector needs compact, light-weight handheld instruments, wearable sensors, and implantable devices such as medical equipment such as hearing aids and active implants that integrate PCBs with flexible substrates to maximize integration density and fit into the smallest possible space. Furthermore, electronic components are being incorporated by automakers into their automobiles in greater quantities. Previously, PCBs were primarily used for things which includes headlight switches and windscreen wipers, but recently they enable many high-tech features that improve safety and ease while driving.
Growth Drivers
From about 8 billion IoT devices in 2020 to more than 25 billion IoT devices in 2030, the number of IoT devices is expected to nearly treble. China would have almost 4 billion consumer IoT devices by 2030, making it the country with the most of them.
Since the amount of data used by organizations has been significantly expanding, high performance computing (HPC) is employed in the development of technologies such as IoT, AI, and 3D imaging. This boosts the ability to process the data in real time. Hence driving the growth of the market.
For instance, the United States Innovation and Competition Act (USICA), which includes USD 52 billion to support domestic chip manufacture, research, and design, was enacted by the U.S. Senate in June 2021.
Initiatives have been launched by the Union government as part of the Digital India program. The plans and programs are broken down into three groups: digital infrastructure, government and on-demand services, and citizen digital empowerment.
The United States' disposable personal income in September 2022 grew from the same month the previous year by about 0.3 percent. Hence owing to this growth in disposable income more people are expected to purchase smartphones and other electronic products. Therefore, further boosting the market growth.
There were estimated to be about 3 billion active internet users worldwide in 2022. That represents approximately 60% of the entire world's population.
Challenges
The global PCB design and stack-up market is segmented and analyzed for demand and supply by end-user into consumer electronics, communications, computers, automotive, and others. Out of these segments, the computers segment is anticipated to generate the largest volume of 35.4 thousand designs by the end of 2021, up from a volume of 29.5 thousand designs in the year 2019. The segment is expanding more quickly as a result of the rising use and demand for computers, laptops, and tablets around the world. Owing to the production of portable computers and laptops, the segment is likewise growing more quickly. Another driver of the segment's growth is the increasing global adoption of technology. The expansion of Internet access and technology is another factor driving the market. For instance, there are up to approximately 25,000 new internet users every single hour, according to an estimate.
The global PCB design and stack-up market is also segmented and analyzed for demand and supply by application into flex circuits, rigid-flex circuits, rigid circuits, hybrid circuits, high-density interconnect, and others. Amongst these segments, the rigid circuits segment is anticipated to hold the largest market volume of 65.0 thousand designs by the end of 2021, up from a volume of 54.2 thousand designs in the year 2019. The growth of this segment can be attributed to the growing acceptance of stiff circuits in recent years and their affordability for PCB design. Further, since rigid circuits are durable and could be made in huge quantities, the market is expanding more quickly. Additionally, given the increasing use of rigid circuits in computers, laptops, tablets, smartphones, and other medical equipment such as X-ray machines, heart monitors, and MRI systems, among other things, the segment growth is quicker than average.
Our in-depth analysis of the global PCB design and stack-up market includes the following segments:
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By Application |
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By End-User |
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By Designers |
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The North America PCB design and stack-up market, amongst the market in all the other regions, is projected to hold the largest market volume of 48.7 thousand designs by the end of 2021, up from a value of 40.6 thousand designs in the year 2019. Growing semiconductor industry, increasing preference for high-speed analogue circuits across multiple industries, and rise in imports of PCB designs is expected to boost the growth of the market in this region. The PCB manufacturing companies struggle to be cost-effective since they lack the capability for large-scale production and the funds to buy more equipment. As a result, they concentrate more on importing PCBs. For instance, the United States imported USD 1.98 billion worth of printed circuit boards in 2020, moving up to the seventh-largest importer in the world.
Ans: The major factors driving the growth of the market are rise in number of IoT devices, robust investment in semiconductor industry, government initiatives for engendering digitalization, and others.
Ans: The market is anticipated to attain a CAGR of ~9.6% over the forecast period, i.e., 2020-2021
Ans: Cyber security threat, high manufacturing costs, and strict government regulations are some of the major factors estimated to hinder the growth of the market.
Ans: The market in North America is projected to hold the largest market share by the end of 2021 and provide more business opportunities in the future.
Ans: The major players in the market are Zuken UK Limited, Cadence Design Systems, Inc., Autodesk Inc., Altium Limited, and more.
Ans: The company profiles are selected based on the revenues generated from the product segment, geographical presence of the company which determine the revenue generating capacity as well as the new products being launched into the market by the company.
Ans: The market is segmented by application, end-user, designers, and by region.
Ans: The computers segment is anticipated to garner the largest market size by the end of 2021 and display significant growth opportunities.
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