Companies Dominating the IO-Link Landscape
- ifm electronic GmbH
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- SICK AG
- Balluff GmbH
- Banner Engineering Corp.
- Siemens AG
- Rockwell Automation, Inc.
- Festo SE & Co. KG
- Datalogic S.p.A
- Hans Turck GmbH & Co. KG
- Pepperl + Fuchs
Browse Key Market Insights with Data Illustration:
In the News
- March 2020: Siemens added backplane bus to their distributed I/O system and more modules for the SIMATIC ET 200MP/SIMATIC S7-1500 IOs. Users may install many channels in the control cabinet while saving money and space thanks to a total of four new multi-channel digital modules, each with 64 channels and an installation width of 35 millimeters.
- March 2021: Balluff GmbH introduced the sensors, which monitor temperature, relative humidity, tilt, and vibration. The sensors are self-monitoring and offer internal environmental data in real time. LEDs on the sensor indicate the quality of the signal, and IO-Link can be used to control things like operation time and hours.
