IC Socket Market Trends

  • Report ID: 5465
  • Published Date: Nov 26, 2025
  • Report Format: PDF, PPT

IC Socket Market - Growth Drivers and Challenges

Growth Drivers

  • Expansion of 5G Technology - The introduction and expansion of 5G technology have significantly increased the demand for high-speed data transmission, low latency, and improved connectivity. 5G networks rely on dense network infrastructure such as base stations and data centers. Additionally, as of September 2023, the United States had 5,375 data centers, more than any other country in the world. A further 522 cases were found in Germany and 517 in the UK. These infrastructure components use plastic IC sockets to ensure reliable connectivity and efficient data transfer.
  • Growing Demand in Telecommunication Sector - The telecommunications industry is looking for IC sockets that can meet the high frequency and bandwidth requirements of 5G technology. Plastic IC sockets, with their advanced thermal and electrical properties, are ideal for this purpose. Furthermore, as of the end of 2022, the number of smartphone subscriptions worldwide reached approximately 6.6 billion. The deployment of 5G networks and the demand for high-speed data transmission are creating opportunities for resin-based IC sockets to be used in networking and communication equipment.
  • Rapid Development in Resin based IC Sockets - The electrical insulation and thermal properties of the resin based IC sockets are designed to be excellent. They are capable of transmitting data at high speeds and reducing the risk of electromagnetic interference. These properties will be even more important in order to ensure the reliability and performance of computerized systems, as IC design becomes increasingly complex.

Challenges

  • Availability of Substitute Materials - The utilization of resin-based IC sockets may be hindered by the presence of more appropriate alternatives, such as metal alloys or ceramics, for particular applications. Plastic is a common material used to make integrated circuit sockets because of its affordability and electrical insulating properties. Both traditional IC sockets and DIP sockets frequently employ this material. Ceramic versions perform better in heat resistance than their plastic equivalents, which makes them perfect for situations where high-temperature stability is required. High-power or high-energy integrated circuits are utilized with these sockets. Therefore, increasing availability of alternative materials are set to pose a competition on the growth of product. Therefore, it is predicted to hamper the IC socket market growth in the coming future times.
  • High Cost of IC Socket is Predicted to Hamper the Market Growth in the Forecast Period
  • Environmental Concerns Associated with IC Socket are Expected to Pose Limitations on the Market Growth in the Estimated Period.

Base Year

2025

Forecast Year

2026-2035

CAGR

8.7%

Base Year Market Size (2025)

USD 942.99 million

Forecast Year Market Size (2035)

USD 2.17 billion

Regional Scope

  • North America (U.S., and Canada)
  • Asia Pacific (Japan, China, India, Indonesia, Malaysia, Australia, South Korea, Rest of Asia Pacific)
  • Europe (UK, Germany, France, Italy, Spain, Russia, NORDIC, Rest of Europe)
  • Latin America (Mexico, Argentina, Brazil, Rest of Latin America)
  • Middle East and Africa (Israel, GCC North Africa, South Africa, Rest of the Middle East and Africa)

Browse key industry insights with market data tables & charts from the report:

Frequently Asked Questions (FAQ)

In the year 2026, the industry size of IC socket is estimated at USD 1.02 billion.

The global IC socket market size was more than USD 942.99 million in 2025 and is anticipated to grow at a CAGR of over 8.7%, reaching USD 2.17 billion revenue by 2035.

The Asia Pacific region is poised to secure the largest revenue share by 2035 in the IC socket market, bolstered by escalating demand across consumer electronics, automotive electronics, and industrial applications.

Key players in the market include TE Connectivity, Smiths Interconnect, Leeno Industrial Inc., Sensata Technologies, Inc., Ironwood Electronics, 3M, JF Technology, Mill-Max Mfg. Corp., Advanced Interconnections Corp., Enplas Corporation, SABIC.
Inquiry Before Buying Request Free Sample PDF
footer-bottom-logos