HVAC Relay Market Size & Share, by Type (Electromagnetic, Solid State, Thermal, Hybrid Relay); Application (Automotive, Industrial, Residential, Commercial) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2023-2035

  • Report ID: 3393
  • Published Date: Mar 16, 2023
  • Report Format: PDF, PPT

Companies Dominating the HVAC Relay Landscape

    • ABB Ltd.
      • Company Overview
      • Business Strategy
      • Key Product Offerings
      • Financial Performance
      • Key Performance Indicators
      • Risk Analysis
      • Recent Development
      • Regional Presence
      • SWOT Analysis
    • TE Connectivity Ltd.
    • C&S Electric Limited
    • Eaton Corporation plc
    • Hitachi, Ltd.
    • Toshiba Corporation
    • Littelfuse, Inc. (IXYS Integrated Circuits Division, Inc.)
    • OMEGA Engineering, Inc.
    • Rockwell Automation Inc.
    • Siemens AG

Browse Key Market Insights with Data Illustration:


In The News

  • Siemens AG launched a force-guided coupling relay in their Sirius 3RQ1 series for electrical systems in infrastructure and industry. The equipment can be assembled easily which reduces the total time required for building control panels.

  • Littelfuse, Inc. has acquired Hartland Controls, a leading manufacturer and supplier of electrical components used primarily in heating, ventilation, air conditioning, and refrigeration (HVAC/R) and other industrial and control systems applications.

Author Credits:  Payel Roy, Dhruv Bhatia

  • Report ID: 3393
  • Published Date: Mar 16, 2023
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

Growing ratio of commercial construction, rising implementation of automation, and technological innovations in HVAC solutions are the major factors driving the market growth.

The market is anticipated to attain a CAGR of 7% over the forecast period, i.e., 2023-2035.

High installation and maintenance cost of HVAC relays, fluctuation in prices of raw materials of HVAC relays, and supply chain disruption as of geopolitical tension are estimated to be the growth hindering factors for the market expansion.

The market in the Asia Pacific region is projected to hold the largest market share by the end of 2035 and provide more business opportunities in the future.

The major players in the market are ABB Ltd., TE Connectivity Ltd., C&S Electric Limited, Eaton Corporation plc, Hitachi, Ltd., Toshiba Corporation, Littelfuse, Inc. (IXYS Integrated Circuits Division, Inc.), and others.

The company profiles are selected based on the revenues generated from the product segment, geographical presence of the company which determine the revenue generating capacity as well as the new products being launched into the market by the company.

The market is segmented by type, application, and by region.

The automotive segment is anticipated to garner the largest market size by the end of 2035 and display significant growth opportunities.
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