Molded Interconnect Device (MID) Market Trends

  • Report ID: 5506
  • Published Date: May 10, 2024
  • Report Format: PDF, PPT

Molded Interconnect Device (MID) Market Trends

Growth Drivers

  • Growing technological advancements in automotive industry - The automotive sector heavily relies on MIDs for various applications, such as automotive sensors, lighting, and control systems. As per estimates, it is anticipated that the global automotive sensor industry will surpass USD 55 billion by 2025. With the rise of electric vehicles (EVs), autonomous driving technology, and the need for more compact and lightweight components, MIDs are becoming increasingly indispensable in this sector.
  • Rising trend of miniaturization products - As electronic devices continue to shrink in size while increasing in functionality, there’s a growing demand for compact, MIDs that enable the integration of multiple functionalities into smaller spaces, aligning with the miniaturization trend.
  • Evolution of consumer electronics - The demand for smaller, sleeker, and more functional consumer electric devices (smartphones, wearables, etc.) drives the need for MIDs. These devices require intricate circuitry and functional design integration, which MIDs facilitate efficiently. In total, the consumer electronics sector brought in around USD 987 billion in revenue in 2022. This propelled the MID market .
  • Innovations in medical industry - The healthcare industry leverage MIDs for various applications, including wearable medical devices, monitoring systems, and implantable devices. The need for smaller, more reliable, and customized solutions in the medical field fuels the growth of MIDs. For instance, Pacemaker makers, including Boston Scientific and Medtronic, were among the first in the medical field to adopt C-MOS technology to integrate digital and analog signals into a single-chip device. This enhanced the device's analysis and control capabilities while decreasing its size and weight. Soon, chip design methods akin to those employed in the creation of compact, lightweight, and potent consumer and military goods were applied to the design of digital medical devices, ranging from defibrillators to stethoscopes. Since then, there has been an increased trend toward shrinking processor chips, instruments, connectors, probes, and sensors built into medical equipment, propelling the market’s growth.

Challenges

  • Cost Considerations- Initial setup costs for MID production can be significant due to the specialized equipment and technology required for manufacturing. This might make MIDs less cost-competitive, especially for smaller-scale productions or in industries with stringent cost considerations.
  • Maintaining high-quality standards and reliability across batches poses a challenge in molded interconnect device manufacturing.
  • Lack of standardized protocols might hinder broader adoption, especially in industries with stringent regulatory requirements.

Molded Interconnect Device Market: Key Insights

Base Year

2023

Forecast Year

2024-2036

CAGR

~ 12%

Base Year Market Size (2023)

~ USD 1.2 Billion

Forecast Year Market Size (2036)

~ USD 4.7 Billion

Regional Scope

  • North America (U.S., and Canada)
  • Latin America (Mexico, Argentina, Rest of Latin America)
  • Asia-Pacific (Japan, China, India, Indonesia, Malaysia, Australia, Rest of Asia-Pacific)
  • Europe (U.K., Germany, France, Italy, Spain, Russia, NORDIC, Rest of Europe)
  • Middle East and Africa (Israel, GCC North Africa, South Africa, Rest of the Middle East and Africa)

Browse Key Market Insights with Data Illustration:


Author Credits:  Abhishek Verma, Hetal Singh


  • Report ID: 5506
  • Published Date: May 10, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2023, the industry size of molded interconnect devices was over USD 4.7 billion.

The market size for molded interconnect devices is projected to cross USD 1.2 billion by the end of 2036 expanding at a CAGR of 12% during the forecast period i.e., between 2024-2036.

The major players in the market are Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation, and others.

In terms of product type, the sensors segment is anticipated to account for the largest market share of 47% during 2024-2036.

The North America molded interconnect devices sector is poised to hold the highest share of 36% by 2036.
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