Research Nester recently published report titled “Atomic Layer Deposition Market: Global Demand Analysis & Opportunity Outlook 2027” delivers detailed overview of ALD market in terms of market segmentation by product type, by type, by application and by region.
The market is segmented by product type into metal ALD, aluminum oxide ALD, plasma enhanced ALD, catalytic ALD and others; by type into precursor type, material type, film type and others; by application into semiconductors & electronics (solar panels, display panels, fuel cells, thermoelectric materials), medical equipment, research & development facilities and others medical equipment, research & development facilities, fuel cells, optical devices and thermoelectric materials and by region. Semiconductors segment is projected to capture the largest market share owing to its wide application in electric circuit, electronics, microprocessors and transistors. The atomic layer deposition market is anticipated to record a CAGR of around 17.55% during the forecast period i.e. 2019-2027.
Atomic layer deposition is a key manufacturing process in the fabrication of semiconductor devices and is used for the synthesis of nanomaterial. It is considered as one of the significant deposition method for producing thin conformal films. The demand for complex and miniaturized components coupled with the advent of nano-technology is expected to drive the ALD market.
On the basis of regional analysis, the atomic layer deposition market is segmented into five major regions including North America, Europe, Asia Pacific, Latin America and Middle East & Africa region. Asia Pacific market is anticipated to capture the largest market share in the atomic layer deposition market owing to increasing demand from end-use businesses such as semiconductors, electronics, medical equipment industry, and solar sector. With the availability of advanced technologies and rising research & development, Asia Pacific region is expected to hold a significant revenue share by 2027.
Demand for NAND Storage
The new technologies such as 3D NAND are being developed with the growing demand for NAND storage. 3D NAND provides higher storage capacity due to multi storeyed stacking of layers of memory structures. Therefore, ALD systems helps in manufacturing 3D NAND for deposition of several controlled and precise layers on the substrate to offer a stacked structure and thereby, increasing its storage capacity.
Due to their excellent output and the fastest surface reaction rate, Plasma Enhanced-ALD (PEALD) is expected to be the fastest growing product type. ALD is a surface sensitive deposition process. PEALD increases the modification of the surface by plasma exposure that changes nucleation. PEALD films are ultra-slim films with an extraordinary flatness and uniformity. The leading companies globally, are focused mainly on delivering new, higher-quality, high-performance dielectric materials. Due to its high efficiency of storing conformal layers for complicated semiconductor components, the market is expected to grow substantially over the forecast period.
However, high cost of ALD system is anticipated to be a key restraint for the growth of atomic layer deposition market during forecast period. Due to high cost of ALD, the vendors in the market providing ALD systems have also reduced their investments in the technology. This had led the semiconductor manufacturers to utilize its substitutes like CVD systems with lower costs compared with ALD systems.
Further, high initial and operational cost of ALD is also expected to restrain the growth of atomic layer deposition market during the forecast period.
Further, for the in-depth analysis, the report encompasses the industry growth drivers, restraints, supply and demand risk, market attractiveness, BPS analysis and Porter’s five force model.
This report also provides the existing competitive scenario of some of the key players of atomic layer deposition market which includes Denton Vacuum, Tokyo Electron Limited, Kurt J. Lesker Company, Veeco Instruments, Beneq , Picosun, Praxair Technology Inc, Metryx Ltd, ASM International NV, Adeka Corporation, Hitachi Kokusai Electric Inc, Applied Materials, Aixtron SE, Oxford Instruments and other prominent players. The profiling enfolds key information of the companies which encompasses business overview, products and services, key financials and recent news and developments. On the whole, the report depicts detailed overview of the atomic layer deposition market that will help industry consultants, equipment manufacturers, existing players searching for expansion opportunities, new players searching possibilities and other stakeholders to align their market centric strategies according to the ongoing and expected trends in the future.